EPP Particle
Coverage
We offer "heavy" and "light" coverage of particles at this time.
It is impossible, as a function of the plating process, to control
particle coverage
exactly. Slight variances in coverage from job to job is normal. If you
plan to repeat order, please specify at time of order. We will take QA
photos of your coverage, and use the photos on repeat jobs to keep your
EPP variances to a minimum.
Please specify heavy or light coating when ordering.
Features to be PI plated should have roughly uniform size over the
entire PCB panel. Coverage is based on the AVERAGE size feature. Surface
area average on top side of PCB does not have to match average surface
area on the back side of the PCB. PCBs with wide EPP feature area variations
will be plated on a best effort basis.
Particalized
Pad & Gap - Size & Specifications
For round features, minimum diameter is .020" / 0.5 mm. Exatron
makes a best effort to plate smaller round features using the smallest
particle
size.
For rectangular features the minimum size is .010" by .040" or
0.25 mm by 1.0 mm
Minimum gap between PI features is:
- for rigid PCB is .010" or .025 mm
- for flex PCB is .012" or .030 mm
If gap is under these limits bridging may/will occur. In that event,
Exatron will supply PI on a best effort basis and will not accept rejects.
With all solder mask, allow .005" minimum air gap around
all PI features. Do not apply silk screen over an PI feature.
It is critical for the customer
to supply a sum measurement of total surface area of all PI features
to be plated. This measurement allows much finer control of the plating
process and will improve plating quality. |
