Particle
Interconnect Manufacturing Process Description
The Exatron Particalization Process (EPP) is the process whereby Exatron
manufactures printed circuit boards to include Particle Interconnect, a
proprietary, patented contact technology. This process is proprietary to
Exatron.
The Exatron Particalization Process is an additional step during
the regular printed circuit board manufacturing process. First, the
substrate is drilled and plated to fill the thru-holes.
- Nickel pads are plated wherever a P.I. feature is to appear
on the PCB
- The particles forming the P.I. are deposited on the nickel
pads
- A second layer of nickel is plated over the particle features
provide the glue to firmly attach the particles to the base pads
- The PCB is then plated up, etched, and finished as any other
PCB
If you are going to be in the San Jose area and would like to see
our EPP line, give Exatron a call and we will be happy to arrange a
tour. |
