PCB Base Materials Specifications

• Kapton: Current process requires minimum thickness of .002".
• FR-4: Current process allows thicknesses from .002" to .200"
• TMM: Current process requires minimum thickness of .020"
• Rigid Polyimide: Current process requires minimum thickness of .005"
• GTEK: Current process requires minimum thickness of .005"

We can manufacture composite PCBs with multiple PCB materials. Example: Thin laminate of TMM3 on thick rigid FR-4. This process has limits and may require special handling fees.

Exatron will work with any platable material. Call for quotation.

PI/EPP Final Plating Specifications

• Nickel Topcoat: Typical plating is 140-160 microinches.
• Solder plate: When used as an etch resist, typical thickness is .0003, maximum.
• Solder reflow: Typical thickness is .0003, maximum
• Gold topcoat: Typical is 20-40 microinches.

Need a finish not shown here? Just ask.

Particle Size Specifications
Following years of plating experience, Exatron has determined that the best particle size is 15 microns. Other sizes my be available at substantial additional cost.