The 5000 is designed to mate with remote test heads mounted on manipulators. Heavy-duty frames are available at 35-, 45-, or 55-degree angles, the choice of which is application specific. Frame shapes are available to allow docking to any test head configuration. The 3000B is designed with a tilting frame to allow setting to any angle from nearly vertical to nearly horizontal..

Plunge To Board Test Sites
All Exatron handlers are designed to accomodate and use "plunge-to-board" test sites. That is, the handler places the DUT right onto the printed circuit board which carries the test site. This may be a large-scale tester ring board, or the direct tester electronics. Typically, the plunger can go as far as 1.5 inches past the back of the handler. Longer distances can be achieved with custom hardware.

Numerous advantages can be gained from the use of plunge-to-board technology. First, lead lengths are reduced. This can be especially critical for RF test applications. Second, in conjunction with EPP contactors, plunge-to-board allows placement of a DUT directly in the final application circuitry for a real in-circuit test.

Easy Front Panel Set-Up
Up and running parts in minutes! Front panel selections include interface, tube counts and various options as required. The control panels use 16 character displays with heavy duty, sealed membrane buttons.

High Frequency Test Sites for SMDs
Exatron's Particalization Process (EPP) provides the finest available test sites for SMDs. EPP is unsurpassed for high speed or high frequency test requirements, and offers true controlled impedance, tested up to 18 GHz. EPP technology begins with individually metallized diamond crystals screened at 15 microns. These diamond particles are selectively electroplated onto the substrate traces using standard photoresist process. EPP creates a 'micro bed-of-nails' that makes electrical contact through penetration of oxides, rather than the traditional wiping action of standard contactors. The DUT is pressed onto the EPP 'bed-of-nails' which pierces the surface oxidation on the device lead and forms a gas tight seal. Typical particle penetration is approximately 5 to 10 microns. The PI interconnect has the electrical integrity of a solder joint as demonstrated with TDR data or side-by-side comparison. Contact resistance is extremely low, approximately 3 milliohms.

For ultra-high performance digital and analog test/programming Exatron systems feature direct dock, plunge to board interfaces for programmers and testers. Test fixtures can be built with virtually no interconnect, altogether eliminating traditional SMD test sockets, daughter boards, flex circuits and all types of adapter hardware. There are numerous benefits to using Exatron's exclusive EPP technology. Lead coplanarity is maintained with successful contact at approximately 10-12 grams/lead. In addition to signal and lead planarity integrity, EPP offers an extremely long lived test environment. When properly implemented and conforming to the EPP mechanical design rules, contacts last over 4 million insertions. Contacts can be readily reconditioned to remove contaminants through a simple reflow procedure with flux and a solder iron.

Interface Options
Exatron provides industry standard parallel control interfaces with every handler. This variety allows the user to select the best interface for easy integration into any test or programming environment. Exatron interfaces are plug-compatible with every Exatron handler.

Positive Binning
Redundant sensors monitor parts as they move through the system ensuring the correct binning of each device. Direct Sorting of rejects guarantees quality. Dual sensors at each output verify the exact position of the shuttle and ensure that the device enters the proper output.

To help assure proper binning, the output shuttle mechanism incorporates a five-phase stepper motor with very fine resolution to assure proper positioning over output tubes or bins. This is especially critical when handling very small devices such as 8-pin .150" SOIC devices.

Programmable Outputs
Eight user-definable outputs allow programmable binning for different test results, improving yields and Q.C. Dual sensors at each output verify the exact position of the shuttle and ensure that the device enters to proper output. Some handlers do not support eight outputs due to mechanical limitations; specifically the PET2, the SIMM Handlers, and certain 3- and 4- bin D-PAK/Power handlers.

Reject Binning
Direct Sorting of rejects guarantees quality. Dual sensors at each output verify the exact position of the shuttle and ensure that the device enters to proper output.