Particle Interconnect

Exatron PI technology begins with 15 micron metal-coated diamond particles. These diamond particles are selectively electroplated onto the substrate area using a modified PCB process. PI creates a “micro bed-of-nails” with 50,000 contact points per square inch. It makes a gas-tight electrical contact by penetrating the oxide layer, rather than the traditional wiping action of standard contactors. PI produces contact resistance below 3 milliohms.

See below for a sample of Exatron’s varied PI applications

Standard Test Sockets

Standard Test Sockets

Universal Test Sockets

Universal Test Sockets

CSP Sockets

CSP Sockets

MEMS Sockets

MEMS Sockets

RF “Zero” Sockets

RF “Zero” Sockets

Multi Site Sockets

Multi Site Sockets

Replacement Handler Contacts

Replacement Handler Contacts

High Density Interconnect

High Density Interconnect

EMI Shielding

EMI Shielding

BeCu Spring Contacts

BeCu Spring Contacts