Model 902-24 Table Top Single Site Test Handler

Test SiteRotating Pickup HeadJEDEC TraysAvailable PrecisorAvailable Tape Input

KEY FEATURES:

  • 27” (685 mm) W by 33” (838 mm) D by 20” (508 mm) H
  • 2 JEDEC trays
  • Handles devices 1.6 x 1.6mm to 60 x 60 mm
  • Handles all SMD and leaded device types
  • Near zero mechanical adjustment or change over kits
  • Software configurable binning
  • Servomotor/PC controlled device placement and contact force
  • Double stack protection
  • Continuous automated retest
  • Remote control operation
  • Vision assisted set up
  • Alerts to mobile device

SPECIFICATIONS:

Device TypesBGA, CSP, DIP, Flat Pack, LCC, LGA, MSOP, PCB, PGA, PLCC, QFP, SIMM, SIP, SIMM, SODIMM, SOIC, SSOIC, TSSOP, and custom devices
Test SocketsSupports nearly all OEM test sockets; Exatron custom built spring probe sockets, Exatron Particle Interconnect (PI) RF and CSP sockets
Test SiteSingle site standard; Dual and quad sites available
Jam Rate1/5000 when using Exatron-built test sockets
Tray2 JEDEC trays, fits all formats, 2" and 4" waffle packs, input and output tube trays, Handler tray carriages equipped with small volume "bucket" for additional sort capability
BinningUp to 8 sorts standard, output tray sort mapping; drop to bucket standard
Rotation0-360° software controlled
Contact Force0-20 lbs standard, software controlled
Tester Control InterfaceTTL/opto isolated; RS-232; GPIB; Ethernet
Tester DUT/Socket Board8" under side of board clearance; up to 18"x 18" square with centered socket; many mounting options
Operator InterfaceWidows 7 user interface; data log file generation software standard
Remote ControlInternet access standard; remote training, troubleshooting, and service standard
Dimensions and Weight27” (685 mm) W by 33” (838 mm) D by 20” (508 mm) H (excludes light pole); under 100 lbs
Facilities Requirements100-240 VAC 50/60 Hz, 80 PSI @ 2 CFM Clean Dry Air (CDA), Internet connection (NOTE: For standard applications upgrade is available allowing no additional required air supply for customers with no CDA available)
Vision AssistStandard built-in camera assists in set up of new devices
Double Part ProtectionStandard built-in vacuum sensor checks for empty socket at start of job and checks every pick and place during operation
Mechanical Precisor ReadyBuilt-in controls for many possible precisor options

 

CHANGEOVER KIT:
Near kit-less changeover:

  • Change the pickup tip (if needed, no tools required)
  • Change out the test socket
  • Load new JEDEC trays
  • Load a previously set up JOB file and run next test

All mechanical changeover adjustments are software-controlled with standard setup.

 

TEMPERATURE UPGRADES:

  • 30" gantry allows for single temperature test site (Can be upgraded in the field)
  • 36" gantry allows for dual temperature test site (Can be upgraded in the field)
  • -55°C - 155°C test capability

 

MEDIA UPGRADES: (May required additional gantry length)

  • Detaper input
  • Exatron-built tape and reel output
  • Bowl feeder input
  • Bucket outputs

 

VISION UPGRADES: (May required additional gantry length)

  • Top-side OCR camera (for serialized device testing)
  • Bottom-side 2D and 3D-lead inspection options (requires table option)

 

MARKING UPGRADES:

  • In-tray laser marking
  • Print and apply label application
  • Many upgrade possibilities

 

MOUNTING UPGRADES:

  • Table top mount standard
  • Many welded steel table options
  • Built-in lift options allow effortless handler movement

See more on Exatron Model 900 pick and place handlers