KEY FEATURES:
- 25" (63.5 cm) W by 28” (71 cm) D by 21.5" 55 cm) H
(With standard 24" gantry. 30" gantry available.) - 2 JEDEC trays
- Single test site standard. Dual sites available.
- Handles devices 1.6 x 1.6mm to 60 x 60mm*
- *requires additional hold down cylinder.
- 1.6 x 1.6mm to 25 x 25mm with thermal test options. (up to 60 x 60mm with special options)
- Handles all SMD and leaded device types
- Near zero mechanical adjustment or change over kits
- User-friendly Windows 10-based GUI
- Software configurable binning
- Servomotor/PC controlled device placement and contact force
- Double stack protection
- Continuous automated retest
- Dino-lite calibration camera ensures precise alignment
- Available in table top or frame-mounted versions
SPECIFICATIONS:
| Device Types | BGA, CSP, DIP, Flat Pack, LCC, LGA, MSOP, PCB, PGA, PLCC, QFN, QFP, SIMM, SIP, SIMM, SODIMM, SOIC, SSOIC, TSSOP, and custom devices |
| Test Sockets | Supports nearly all OEM test sockets; Exatron custom built spring probe sockets, Exatron Particle Interconnect (PI) RF and CSP sockets |
| Jam Rate | 1/5000 when using Exatron-built test sockets |
| Tray | 2 JEDEC trays, fits all formats, 2" and 4" waffle packs, input and output tube trays, Handler tray carriages equipped with small volume "bucket" for additional sort capability |
| Binning | Up to 8 sorts standard, output tray sort mapping; drop to bucket standard |
| Contact Force | 0-20 lbs standard, software controlled up to 100 lbs with thermal options or additional hold down cylinder. |
| Tester Control Interface | TTL/opto isolated; RS-232; GPIB; Ethernet |
| Tester DUT/Socket Board | 8" under side of board clearance; up to 18"x 18" square with centered socket; many mounting options |
| Operator Interface | Widows 7 user interface; data log file generation software standard |
| Remote Control | Internet access standard; remote training, troubleshooting, and service standard |
| Dimensions and Weight | 25” (63.5 cm) W by 28” (71 cm) D by 21.5” 55 cm) H (excludes light pole); under 100 lbs |
| Facilities Requirements | 100-240 VAC 50/60 Hz, 80 PSI @ 5 CFM Clean Dry Air (CDA), Internet connection (NOTE: For standard applications upgrade is available allowing no additional required air supply for customers with no CDA available) |
| Vision Assist | Standard built-in camera assists in set up of new devices |
| Double Part Protection | Standard built-in vacuum sensor checks for empty socket at start of job and checks every pick and place during operation |
| Mechanical Precisor Ready | Built-in controls for many possible precisor options |
CHANGEOVER KIT:
Near kit-less changeover:
- Change the pickup tip (if needed, no tools required)
- Change out the test socket
- Load new JEDEC trays
- Load a previously set up JOB file and run next test
All mechanical changeover adjustments are software-controlled with standard setup.
THERMAL IC TEST UPGRADES:
- Single temp. test site (requires 30" gantry)
- (-75°C) -55°C - 155°C (+175°C) test capability
- Thermal options require frame mounted option
MEDIA UPGRADES: (May required additional gantry length)
- Detaper input (Frame mount suggested)
- Exatron-built tape and reel output (Frame mount suggested)
- Small volume tube to tube
- Bucket output
VISION UPGRADES: (May required additional gantry length)
- Top-side OCR camera (for serialized device testing)
- Bottom-side 2D and 3D-lead inspection options (requires frame mount option)
MARKING UPGRADES:
MOUNTING UPGRADES:
- Table top mount standard
- Many welded steel frame/table options
- Built-in lift options allow effortless handler movement
OTHER OPTIONS:
- Printed label application
- Ink dot application