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HOT/COLD/AMBIENT TEST

Below are handlers that Exatron has built to test various MEMS devices at ambient, cold, and hot temperatures.

The usual order of testing, and the recommended best practice, is to test with ambient or room temperature first, then cold, and hot last; so that the device is placed in the output at a slightly warm temperature that collects no frost.

  • Standard hot test to 155° C
  • Up to 300° C possible
  • -20° C with thermo-electric cooling
  • -55° C with fluid cooling

THERMAL TEST HEADS

THERMALHEAD1 Hot head on left | Cold head descending to test site | Ambient head on right

THERMALHEAD1
Hot head on left | Cold head descending to test site | Ambient head on right

THERMALHEAD2 Underside of thermal heads with clear defrost-purge enclosures

THERMALHEAD2
Underside of thermal heads with clear defrost-purge enclosures

THERMAL TEMPERATURES DISPLAYED

THERMALDISPLAY Hot test displayed at 126° C | Cold test displayed at -60.4° C

THERMALDISPLAY
Hot test displayed at 126° C | Cold test displayed at -60.4° C

THERMALDISPLAY2 Preheat tray displayed at 125° C | Hot test sites displayed at 124° & 130° C

THERMALDISPLAY2
Preheat tray displayed at 125° C | Hot test sites displayed at 124° & 130° C

THERMALDISPLAY3 Cold test temperatures | Air pressure/vacuum testing

THERMALDISPLAY3
Cold test temperatures | Air pressure/vacuum testing