The Model 923 WLCSP-TT (Wafer Level Chip Scale Tri-temp Test) Handler, equipped with top and bottom-side robotic alignment, handles, tri-temp tests, and laser marks devices as small as 0.8 mm x 0.8 mm with accuracy and efficiency.

Easily adaptable to a wide range of input/output options with quick and easy changeover, the Model 923 WLCSP-TT is a flexible, reliable test system.

FEATURES:

• Linear motor-driven gantries allow incredible accuracy and speed.
  • Resolution: 0.03 mm (0.001″)
  • Max Velocity: 150 cm/s (60″/s)
• Exatron’s Wide Range Thermal Head (WRTH) offers a minimum working range of -55°C to +155°C (-75°C to +175°C hardware capability) with +/- 0.5°C control. (Add Copperhead Thermal Sockets for blazing fast soak times and unheard of stability)
• No fluids required.
• Innovative purge air and test shutter system guarantees no frost buildup during test.
• Equipped with tube, tape, tray input/output and random sort input all with quick and easy changeover.
  • Output tape comes standard with in-pocket Pin1 inspection.
  • Input tape features pneumatic shutter to prevent small devices popping out of tape.
• 360° rotating pickup head travels on X, Y, and Z axes.
• Robotic alignment ensures accurate placement of devices as small as 0.8 mm x 0.8 mm.
  • Top inspection conducts gross alignment to ensure precise pickup.
  • Bottom inspection identifies X, Y, angle position of device and pickup head adjust as needed.
• Pneumatic precisor pockets ensure precise marking of small devices.
• Exatron test sockets are specifically designed to handle fragile devices.